International conference on metallurgical coatings and thin films ICMCTF95JEHN, Hermann A; MATTHEWS, Allan; MCGUIRE, Gary E et al.Thin solid films. 1995, Vol 270, Num 1-2, issn 0040-6090, 667 p.Conference Proceedings

International conference on metallurgical coatings and thin films ICMCTF95JEHN, Hermann A; MATTHEWS, Allan; MCGUIRE, Gary E et al.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, issn 0257-8972, 386 p., 1Conference Proceedings

Multilayer PVD coatings for wear protectionHOLLECK, H; SCHIER, V.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 328-336, issn 0257-8972, 1Conference Paper

Photon frequency dependent electron relaxation time in noble metals : effect of voidsEISENHAMMER, T.Thin solid films. 1995, Vol 270, Num 1-2, pp 55-59, issn 0040-6090Conference Paper

Quasicrystal films : numerical optimization as a solar selective absorberEISENHAMMER, T.Thin solid films. 1995, Vol 270, Num 1-2, pp 1-5, issn 0040-6090Conference Paper

Structural characterization of ion-beam-induced epitaxially crystallized thin layers of III-V and IV-IV semiconductorsKOBAYASHI, N.Thin solid films. 1995, Vol 270, Num 1-2, pp 307-313, issn 0040-6090Conference Paper

Study of the material properties and suitability of plasma-deposited fluorine-doped silicon dioxides for low dielectric constant interlevel dielectricsSHANNON, V. L; KARIM, M. Z.Thin solid films. 1995, Vol 270, Num 1-2, pp 498-502, issn 0040-6090Conference Paper

Surface roughening of metallic substrates by high pressure pure waterjetTAYLOR, T. A.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 95-100, issn 0257-8972, 1Conference Paper

A study of hillock formation on Al-Ta alloy films for interconnections of TFT-LCDsIWAMURA, E; OHNISHI, T; YOSHIKAWA, K et al.Thin solid films. 1995, Vol 270, Num 1-2, pp 450-455, issn 0040-6090Conference Paper

A thickness model for the TiSi₂/TiN stack in the titanium salicide process moduleJIUNN-YANN TSAI; PUSHKAR APTE.Thin solid films. 1995, Vol 270, Num 1-2, pp 589-595, issn 0040-6090Conference Paper

Dielectric reference coatings for the evaluation of thin film characterization techniquesBECK, U; REINERS, G.Thin solid films. 1995, Vol 270, Num 1-2, pp 85-90, issn 0040-6090Conference Paper

Erosion rate testing at high temperature for turbomachinery useTABAKOFF, W; SHANOV, V.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 75-80, issn 0257-8972, 1Conference Paper

Growth and oxidation resistance of boron-modified and germanium-doped silicide diffusion coatings formed by the halide-activated pack cementation methodCOCKERAM, B. V.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 20-27, issn 0257-8972, 1Conference Paper

In-situ failure analysis of a Ni coating deposited by electrolyte brushingGRIGORESCU, I. C; NAVAS, G.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 132-134, issn 0257-8972, 1Conference Paper

Numerical techniques useful in the practice of ellipsometryCOMFORT, J. C; URBAN, F. K.Thin solid films. 1995, Vol 270, Num 1-2, pp 78-84, issn 0040-6090Conference Paper

Simulation of collilmated flux distributions during physical vapor depositionZHOU LIN; CALE, T. S.Thin solid films. 1995, Vol 270, Num 1-2, pp 627-631, issn 0040-6090Conference Paper

Surface modification of aluminum alloys in molten salts containing CeCl₃MANSFELD, F; PEREZ, F. J.Thin solid films. 1995, Vol 270, Num 1-2, pp 417-421, issn 0040-6090Conference Paper

Characterization of native and adsorbed thin films on silicon detector surfaces : static and kinetic applicationsAZZAM, R. M. A.Thin solid films. 1995, Vol 270, Num 1-2, pp 289-294, issn 0040-6090Conference Paper

Chemical vapor co-deposition of C and SiC at moderate temperature for the synthesis of compositionally modulated Si_xC_1-x ceramic layerMAURY, F; AGULLO, J. M.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 119-125, issn 0257-8972, 1Conference Paper

Deposition of (Ti,Al)N coatings by means of electron beam ion plating with evaporation of Ti and Al from two separate cruciblesPALMERS, J; VAN STAPPEN, M.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 363-366, issn 0257-8972, 1Conference Paper

Growth of dielectric layers on the InSb surfaceANJALI RASTOGI; REDDY, K. V.Thin solid films. 1995, Vol 270, Num 1-2, pp 616-620, issn 0040-6090Conference Paper

Manufacturabililty of the CMP processFARID MALIK; MASOOD HASAN.Thin solid films. 1995, Vol 270, Num 1-2, pp 612-615, issn 0040-6090Conference Paper

Mechanical properties and adhesion strength of TiN and Al coatings on HSS, steel, aluminium and copper characterized by four testing MethodsMÜLLER, D; FROMM, E.Thin solid films. 1995, Vol 270, Num 1-2, pp 411-416, issn 0040-6090Conference Paper

Non-destructive determination of step coverage on semiconductor wafersJOHNSON, W. H; BRENNAN, B.Thin solid films. 1995, Vol 270, Num 1-2, pp 467-471, issn 0040-6090Conference Paper

Preparation and characterization of hard mono- and multilayer plasma-assisted chemically vapour deposited coatingsLEONHARDT, A; BARTSCH, K; ENDLER, I et al.Surface & coatings technology. 1995, Vol 76-77, Num 1-3, pp 225-230, issn 0257-8972, 1Conference Paper